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The following Hughes Specifications are available at the Space Materials Science and Engineering, JPL. These specifications contain Hughes proprietary material and they are only for NASA use. SPEC. # TITLE ISSUE/REVISION DATE 760828 Compound, Adhesive and Staking, Room-Temperature Curing, Flexible Epoxy Sept. 86 B185723 Silicone Compound, Room-Temperature Vulcanizing Aug. 91 HMS 16-1562 Silicone Compound, Room-Temperature Vulcanizing June 89 HMS20-1898 Epoxy Adhesive, Room Temperature Curing, Flexible Nov. 73 MIS-26862 Materials Specification for Epoxy, Adhesive, Room Temperature Curing, Flexible Oct. 79 MIS-26872 Materials Specification for Epoxy, Adhesive, Room Temperature Curing, Flexible Oct. 79 EC-2216 B/A SCGMS 51021 Encapsulant, Silicon, Clear, RTV, for Space Use Aug. 87 SCGMS 52012 Encapsulant, Silicon, Clear, RTV, Space Grade Apr. 94
For more information you can contact: Yoseph Bar-Cohen, Cheng Hsieh or Tim O'Donnell Jet Propulsion Laboratory (JPL), M.S. 125-112, 4800 Oak Grove Drive, Pasadena, CA 91109-8099 Phone: 818-354-2610 Fax: 818-393-5011 E-Mail: yosi@jpl.nasa.gov