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Last update January 12, 1996


5.3.1 Hughes

 
The following Hughes Specifications are available at the Space Materials Science and Engineering, JPL.
These specifications contain Hughes proprietary material and they are only for NASA use.


SPEC. #		TITLE                                            				ISSUE/REVISION DATE

760828		Compound, Adhesive and Staking, Room-Temperature Curing, Flexible Epoxy		Sept. 86

B185723        	Silicone Compound, Room-Temperature Vulcanizing	 				Aug.  91

HMS 16-1562	Silicone Compound, Room-Temperature Vulcanizing	 				June  89

HMS20-1898	Epoxy Adhesive, Room Temperature Curing, Flexible				Nov. 73

MIS-26862	Materials Specification for Epoxy, Adhesive, Room Temperature Curing, Flexible	Oct. 79

MIS-26872	Materials Specification for Epoxy, Adhesive, Room Temperature Curing, Flexible	Oct. 79
		EC-2216 B/A

SCGMS 51021   	Encapsulant, Silicon, Clear, RTV, for Space Use					Aug. 87

SCGMS 52012   	Encapsulant, Silicon, Clear, RTV, Space Grade					Apr. 94

For more information you can contact: Yoseph Bar-Cohen, Cheng Hsieh or Tim O'Donnell Jet Propulsion Laboratory (JPL), M.S. 125-112, 4800 Oak Grove Drive, Pasadena, CA 91109-8099 Phone: 818-354-2610 Fax: 818-393-5011 E-Mail: yosi@jpl.nasa.gov